| This work considers electrodeposited Sn-Cu films for electronic packaging using an additive-free sulphate bath. A background of packaging techniques is given, and eutectic Sn-Cu is set within this context. The films were deposited onto Au- and Cu-coated Si wafers, and wrought Cu. Morphology, coverage and composition are surveyed under a variable set of direct- and pulsed-current parameters. It is determined that pulse duty and average current density have a marked effect on the films. Solderability trials produced well-covered films on wrought Cu substrates. Citric acid additions were studied for use as a bath stabilizer. |
