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A study into the effect of wicking due to capillary action during the curing of epoxy resin

Posted on:1998-07-22Degree:M.SType:Thesis
University:University of Massachusetts LowellCandidate:Greco, Philip Dean, JrFull Text:PDF
GTID:2461390014479936Subject:Materials science
Abstract/Summary:
The following thesis is an account of experimentation on epoxy resin, and expanded polysulfone filament membranes. The experimentation categorized both epoxy resin rheology and the surface energy of the expanded polysulfone substrate material. Laboratory work was accomplished to modify the resin rheology using glass microspheres, and fumed silica in the expectation that increased viscosity would reduce the capillary effect and the related defect, wicking.;Modification of Shell Epon$spcircler$ 826 with a combination of 3M K-1 microspheres and fumed silica, reduced capillary wicking from 20-25 mm. to 10-15 mm. when cast into a filament membrane cartridge.;Modification of Epon$spcircler$ 826 and Epicure$spcircler$ 3061 by the addition of microspheres, and fumed silica would not be feasible within the constraints of manufacturing. However, conclusions suggest that a higher viscosity resin could be forced to wet out the substrate material under gas pressure. The higher viscosity should result in reduced wicking without sacrificing mechanical properties.
Keywords/Search Tags:Wicking, Resin, Epoxy, Capillary
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