| Copper clad foil(CCL)is the PCB substrate in PCB manufacturing,and is the most widely and most important substrate for PCB manufacturing.Epoxy resin is one of the important raw materials in copper clad foil matrix resin.Compared with the traditional bisphenol A epoxy resin,bisphenol S epoxy resin has significantly improved the heat resistance due to its sulfone-based mechanism.At the same time,the cured product has good thermal stability,thermal deformation temperature and bonding strength.Resorcinol diglycidyl ether has the characteristics of low viscosity and easy operation.The copper clad foil matrix resin has special high requirements for its heat resistance and easy operability,so bisphenol S epoxy resin,resorcinol diglycidyl ether as copper clad foil matrix resin has a very good application prospect.(1)Through bisphenol S,epichlorohydrin as raw material.Bisphenol S epoxy resin was synthesized by isopropanol solution precipitation method.The structural functional groups were determined by FT-IR.The melting point was measured by DSC,and only one absorption peak was found,and the temperature of the melting peak was Tm=169°C.Short melting range.Finally,bisphenol S epoxy resin with yield of 90% and epoxy value of 0.501 was obtained.(2)By using epichlorohydrin and resorcinol as raw materials.The ring-opening reaction was carried out using benzyl triethyl ammonium chloride as catalyst.The closed-loop reaction was carried out with liquid alkali.Finally,resorcinol diglycidyl ether with yield of 87% was obtained by washing and vacuum distillation.(3)The bisphenol S epoxy resin with different ratios was heated with 128 epoxy resin and 431 epoxy resin as the matrix resin,and stirred and mixed.Two new bisphenol S epoxy resins were obtained.Then different curing agents were added to the curing reaction.At the same time,DICY adhesive with resorcinol diglycidyl ether/ curing agent was prepared.The viscosity of the above samples was tested.The viscosity results showed that the viscosity was large at 20°C,and suitable at 60°C.Adding curing agent at 60°C was convenient for stirring,which was conducive to the full curing reaction.The apparent activation energy was obtained by testing the gelation time.The results showed that the apparent activation energy was low and the reaction activity was high,so the two components were separated and preserved separately.And the above adhesive samples were put into the differential scanning calorimetry for curing reaction,with different heating rate tracking test to determine the curing time,curing temperature.(4)The above samples were cured at their respective curing time and curing temperature.The thermal properties and water absorption of the obtained cured products were analyzed.Finally,it was found that when the mass ratio of bisphenol S epoxy resin to 128 epoxy resin and 431 epoxy resin was 1:4,the corresponding cured thermal properties were the best,with water absorption below 0.12% and good hydrophobicity.The thermal decomposition temperature of resorcinol diglycidyl ether/ curing agent DICY was 277.26°C,and the thermal stability of the cured product was good.And the cured resin has good hydrophobic property,the water absorption rate is less than 0.15%,and the hydrophobic property is excellent,which meets the requirements of copper clad foil matrix resin. |
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