Simulative And Experimental Research On Electroplated Grinding Wheel With Ordered Microgrooves

Silica glass,engineering ceramics,monocrystalline silicon and other hard and brittle materials are widely used in aerospace,optical instruments,automation equipment and other cutting-edge fields.The machining of these hard and brittle materials usually requires grinding.Due to the advantages of high machining efficiency,abrasion resistance,and high thermal conductivity,electroplated superabrasive grinding wheel plays an important role in the precision machining of the above materials.However,the common electroplated superabrasive grinding wheel has some problems,such as small space for chip storage,and the grinding fluid is difficult to enter the grinding zone for effective lubrication and cooling.Therefore,how to improve the working surface structure of the grinding wheel to improve its performance of the lubrication and cooling and the ability of chip storage and removal,has always been the focus of research in the grinding field.This study proposed an electroplated grinding wheel with ordered microgrooves,and the grinding performance of the grinding wheel was investigated by carrying out the flow field simulation in the grinding zone,silica glass material removal simulation and the grinding experiment.The main research contents are as follows:(1)The SPH method was used to simulate the flow field in the grinding zone of the electroplated grinding wheel with ordered microgrooves.The influence of microgroove width,grinding wheel rotational velocity and grinding fluid velocity on the grinding fluid flow state and the chip motion behavior was studied.The simulation result is shown that during grinding by the electroplated grinding wheel with ordered microgrooves,the microgrooves in the wedge-shaped zone can carry part of the grinding fluid into the grinding zone,which can effectively lubricate and cool the grinding zone.Microgrooves entering the grinding zone can continue to accommodate and take away the grinding fluid,increase the effective flow rate in the grinding zone,and further improve the lubrication and cooling performance in the grinding zone.Chips can enter the microgrooves under the scouring of the grinding fluid,which enhances the chip storage ability of the electroplated grinding wheel with ordered microgrooves,and reduces the crush of the chip/workpiece and the chip/grinding wheel.Reducing the microgroove width,increasing the grinding wheel rotational velocity and the grinding fluid injection velocity is beneficial to improve the lubrication and cooling performance and chip storage and removal ability of the electroplated grinding wheel with ordered microgrooves.(2)A random distribution model of grains is established,the position and orientation of grains followed the random distribution,and the size and protrusion height of grains followed the normal distribution.Based on the model,the finite element simulation of silica glass grinding is established.The influence of microgroove width on material removal process of silica glass grinding is explored.The simulation result shows that microgrooves of the grinding wheel entering and leaving the grinding zone will cause fluctuation of grinding force,and with the increase of microgroove width,the fluctuation range of the grinding force is increased.(3)The electroplated grinding wheel with ordered microgrooves was prepared,whose microgroove width is 0.1 mm.The experiments were carried out for silica glass grinding.The experimental results are shown that the grinding force of the electroplated grinding wheel with ordered microgrooves and conventional diamond grinding wheel increases with the increase of the grinding depth and the workpiece feeding speed.While the grinding force produced by the former in silica glass grinding is always lower than that produced by the latter.The grinding surface roughness of the electroplated grinding wheel with ordered microgrooves increases with the increase of grinding depth and decreases with the increase of grinding wheel linear velocity.