Research On Preparation Technology Of Diamond Cutting Line For Cutting Solar Crystalline Silicon Square Ingot

With the rapid development of clean energy,the goal of low-cost photovoltaic power grid is imminent.In the photovoltaic industry,silicon manufacturers are constantly expanding production capacity and reducing production costs.Small ingot truncation is an important part of the cost of silicon cell.In the cutting process of solar crystal silicon ingot,most manufacturers use traditional diamond saw blade,steel wire and mortar cutting methods.The cutting speed of diamond saw blade is fast,but the saw gap is wide.In the cutting process,a large number of silicon materials are cut into silicon powder and enter into the sewage,resulting in high silicon loss.The silicon consumption of cutting seam by saw blade is one third of that of cutting seam by silicon.The cutting speed of steel wire and mortar is low,mortar and silica fume enter into sewage together,so the separation cost is high.Cutting will cause a large number of mortar to be recycled,resulting in bad environment,and the sewage treatment cost is also high.The cutting speed of cut-off cutting line is 2-3 times of that of steel wire cutting mode,and the silica fume produced is only mixed with water-based coolant,so the sewage treatment cost is low.The solar crystal silicon ingot can be cut by cut-off wire cutting,which can realize high-speed cutting,environmental protection and low-cost production.Electroplated diamond cutting line has the advantages of strong cutting force,neat cutting seam,smooth cutting surface,low silicon consumption,low environmental pollution and high cutting efficiency in the cutting of silicon ingot,which has been developed rapidly in recent three years.Not only in the field of photovoltaic,but also in sapphire,magnetic cutting and other fields.Electroplating cutting line has been developed rapidly in recent three years because of its strong cutting force and neat cutting seam.Not only in the photovoltaic industry,but also in sapphire,magnetic cutting and other fields.However,there are still some problems,such as unstable process,diamond particles easy to fall off,high production cost and so on,which hinder the promotion of electroplating cutting line.Based on the basic theory of composite electroplating,this paper studies the process parameters that affect the electroplating of cut-off cutting line.In the experiment,high carbon steel wire with diameter of 0.27 mm was used as the baseline of diamond wire,nickel sulfamate was used as the plating solution,and w30-40 diamond particles were used as the diamond particles.Through the study of nickel plating pretreatment of diamond particles,it was concluded that electroless nickel plating pretreatment of diamond particles was the most suitable for the production of cutting line The weight gain ratio of nickel plating on diamond particles for stable production was determined by the study of nickel number.By studying the effect of current density of sulfamate nickel plating on coating brittleness,the best current density of cut-off line for electroplating production was confirmed.By studying the influence of the thickness of nickel sulfamate plating on the cutting effect of electroplated diamond wire,the best embedding rate of diamond particles in nickel plating was obtained.By studying the influence of the number of diamond particles per unit area on the cutting effect of electroplated diamond wire,the number of diamond particles per unit area corresponding to the cutting line with the best performance is obtained;by studying the influence of stress removal temperature and time on the cutting efficiency of electroplated diamond wire,the best stress removal parameters are found.