Research On The Application Of Au Flash PCC Wire In Grade 0 Automotive Electronic Package Bonding

With the increasing market share of automotive electronics,the requirements for integrated circuit packaging have become higher and higher.At present,the process capability used in semiconductor packaging is constantly improving,and the pressure resistance is getting stronger and stronger,but the chip cost is gradually decreasing.In traditional consumer electronics packaging,due to the fluctuations in the market price of gold and the limitations of its own material characteristics,the low cost of copper wire and its outstanding electrical conductivity,thermal conductivity,and stability make it slowly replace gold wires and become dominant in the semiconductor market.However,in the automotive electronics industry,due to the classification of automotive electronics grades and high quality requirements,the market still focuses on gold wire bonding.The main consideration is that copper wires are susceptible to oxidation and corrosion under long-term working conditions.It is easy to cause functional failure,resulting in high repair costs,so each factory has always maintained a cautious attitude towards copper wire automotive electronics.According to the requirements of high reliability and low cost of automotive electronics,this article develops and researches new palladium-coated copper alloy wire EX1 R in the fields related to safe autonomous driving.By studying the failure modes of copper wires,such as copper wire corrosion,crater,and machine operation poor performance,in progress of process prevention and experimental design,use multiple tools(push-pull testing machine,high-power electron microscope,grinding machine,etc.)to collect data,find the optimized parameter interval through analysis software such as software JMP,consider palladium-coated copper alloy’s production quality and operational stability of the line are evaluated,and the reliability status of its products in the later stage is evaluated to meet the industry specification requirements of AEC-Q100.Compared with the traditional palladium-plated copper wire under the same conditions,it can be concluded that the cost of the wire is reduced by 6%,and the welding characteristics are greater than the traditional palladium-plated copper wire in terms of push-pull force or operating parameter range.The production workability can be increased by375%,and can improve 0.075% in package yield improvement.In terms of reliability simulation,the palladium-plated copper alloy wire can meet the requirement of no chip failure in a high-temperature environment of 2000 hours.It has 1000 hours more simulated life space than the palladium-plated copper wire,and absorbs moisture and stress in a long time.Maintain stable welding characteristics in the environment without fluctuation.According to the comparative conclusions,the superior position of the palladium-plated copper alloy wire is determined,so that this new material can be smoothly introduced and used to improve the automotive electronic packaging process,giving the industry the use of copper wire bonding to improve the manufacturing cost of automotive electronic chips and extend the service life of the chips.It should provide a certain guiding role for the future development of automotive electronics.