Research And Numerical Simulation Of Photosensitive Resin Based On Projection Micro-stereolithography

3D printing technology has ushered in rapid development in recent years,posing challenges to traditional production modes and concepts,and has gradually become a subversive technology in the future manufacturing industry,widely used in micro-nano manufacturing,aerospace and flexible electronics and other fields and industries.Stereolithography(SLA)is the earliest and most mature technology in the field of 3D printing.It has the characteristics of high printing accuracy and occupies a large market share.At present,my country’s research on stereolithography technology mainly focuses on hardware equipment,while the research and development of supporting consumables is relatively small,which seriously affects the development of 3D printing technology.Therefore,it is very important to prepare low-cost,high-performance photosensitive resins.In this paper,a photosensitive resin suitable for the 405nm band has been developed.The material has superior performance and low price,which plays a positive role in the development of 3D printing systems.Based on free radical photocuring system,epoxy acrylate(EA)is used as oligomer,and the viscosity,photocuring effect of photosensitive resin is affected by studying oligomers,reactive diluents,photoinitiators,additives and other components and their proportions.speed,curing shrinkage,etc.,and at the same time determine the optimal ratio of different components,and calculate the photosensitive resin process parameters.When EA:CFTA:TMPTA:PI=32:32:32:4 and PI is TPO,the viscosity of the photosensitive resin system is 220 m Pa·s,the tensile strength is 82 MPa,the elongation at break is 5.2%,and the curing shrinkage is 6.5%,transmission depth D_p=120.25μm,critical exposure threshold E_c=1.8 m J/cm~2.Based on Fourier heat conduction law and curing reaction kinetics theory,the thermochemical model and curing kinetics model needed for numerical simulation are established,and the numerical model of curing process is built by COMSOL software,and the distribution and degree of temperature field and curing degree field inside the photosensitive resin are obtained.process of change.The main influencing factors of temperature field and curing degree field are analyzed.By increasing curing temperature and thermal conductivity,not only curing time can be shortened,but also the uniformity of temperature field and curing degree field can be improved.It lays a foundation for realizing molding simulation,optimizing material performance parameters and processing parameters,and predicting material mechanical properties.