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The Design Of Hot Runner Stack Mold For Mobile Phone Shell

Posted on:2015-07-15Degree:MasterType:Thesis
Country:ChinaCandidate:W R LvFull Text:PDF
GTID:2381330596479805Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The difference between stacked mold and ordinary injection molding is that stacked mold cavity is distributed an two or more lvels,showing overlapping arrangement.That is the equivalent of multiple molds to be stacked together to make full use of injecion machine ctapacity and mass prodaccd flat workpieces.By.this way,it can reduce the cost of production.Hot runter tehnology can save raw materials,and it is easy to automate,improve product performance and shorten the production cycle,etc.Combining together stacked mold and hot runner technology,you only need to increase a little mold costs,you?can significantil increase production,reduce costs and achieve efficient automation,So the development and application of hot runner stack mold technology is receiving more and more attention.This paper take phone shells as a rescarch subject,their appearance,struture.thickness and other parameters were analyzed.Taking Optimizing the hot runner stack mold's gating system as the goal,this paper calculates gating system's critical cross-sectional dimiensions of the gate,sprue,shunt runner,main runner etc according to plastic rheology theony;tking Optimizing the gate's location and quantities as the goal.this paper use injection mold CAE technology to warp analyze two schemes.then Analysis results are compared to find which scheme is more suitable for hot runner stack mold.Cenerally residual stress is large in products in conventional constant pressure scheme,For this reason,this paper prppose two packing scheme Later this paper dose warp analysis and stress analysis on the two schemes.Simulation results show that two sections packing scheme is more suitable for hot runner stack mold.Compared with the traditional constant packing plan.We propose two sections paking scheme,and By comparing two plans'wary analysis and stress analysis,we found two sections packing scheme is more suitable for hot runner stack mold.Aeeording to the thermodynamic theory,heating system's proeess parameters,cooling medium's flow rate and the like in terms of temperature adjusting system's critical parameters are calculated,designed and simulated.Simulation results show that the proposed heating system and temperature control system are feasible.In this paper,the clamping force is calculated and checked the diameter and length of slider angle pin are calculated according to the working condition of Sideways pulling mechanism—the main components of stack mold.Besides,stack mold is designed by using CAD.Clamping movement principle is introduced in detail in this paper.Papers in the injection molding process phone shell for the study.Research methods are closer to the using methods in actual factory.Useful references for the development and application of hot runner stack mold provided.
Keywords/Search Tags:Hot runner, Stack mold, Rheology, Injection mold CAE
PDF Full Text Request
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