| In this work, processing-structure-property relationships of thin (∼1 μm) films are developed for materials with applications in microelectronics, microelectromechanical systems (MEMS), or magnetic data storage through experimental studies to optimize material properties and improve device performance and reliability.; Variations in film microstructure were achieved through changes in deposition conditions, curing conditions, or through direct changes in material density or composition. Changes in material properties as a result of these (chemical, structural, or physical) modifications are quantified through experimental measurements. Changes in mechanical behavior are quantified through (“nano”-scale) instrumented depth-sensing indentation (DSI) experiments. Changes in material structure and composition are quantified by infrared spectroscopy, ellipsometry, ion beam analysis, scanning electron microscopy, and atomic force microscopy.; Structure-properties relationships are developed for organosilicate-based dielectric materials for microelectronic interconnection arrays with a focus on maximizing film modulus and hardness while minimizing dielectric constant. Relationships between film properties and film structure with changes in deposition conditions are developed for low-pressure chemical vapor deposited silicon nitride films used in MEMS and microelectronics. Specifically, changes in film composition as a result of deposition conditions are related to changes in film stress.; DSI is used to measure the contact responses of silica foam films and flexible magnetic data storage tape for which the microstructural inhomogeneities are comparable to the scale of the indentations. Images of residual indentation impressions are used to determine deformation mechanisms, and contact responses are interpreted by a new method. Differences in the deformation of magnetic data storage tape are quantified using DSI through previously developed deconvolution models and also through the new interpretation method developed for silica foam films.; The adhesion of polymer-metal interfaces relevant to MEMS component fabrication is investigated. Degradation in interfacial adhesion after storage in aqueous environments is quantified using four-point-bending experiments. Interfacial bond hydrolysis is proposed as the mechanism by which interfacial adhesion degrades on exposure to water. |
