Cost modeling system for the IC packaging industry

The semiconductor market is experiencing a remarkable growth, causing similar growth patterns for the IC packaging world. Semiconductor companies are building new fabs in an effort to keep up with the demand for their die. With costs for new fabs running {dollar}1 billion and up, packaging subcontractors need to do an effective job with their service at a reasonable cost.; This research will focus on providing a cost estimation tool for new products which will aid in the fast introduction of the product with a more accurate knowledge of the risk been taken and the profitability that the companies will experience. The work emphasizes the communication between product managers, designers, suppliers, planners, process and industrial engineers at the early stages in order to capture all the cost drivers and determine the expected cost of a product.; The cost estimation tool will determine the cost of a product broken down for each process, including details of operations such as: direct labor, indirect labor, equipment depreciation, manufacturing overhead and facilities. It will also provide information on material cost, and other allocated costs (Quality, service, General and Administrative (GNA), interest and others). This will help managers make decisions and recommend changes in the product before its introduction.