Design And Optimization For The Bonding Head With Parallel Mechanism Based On IC Encapsulation

The IC chip encapsulation equipment which is composed of precision mechanical structure,electric control,image identify and photoelectricity detection parts and so on includes the execute implement and the sensor which can apperceive and control the outside imformation, which fully displays the multil-subjects frontier's high synthesis and osmosis.Currently,how to ulteriorly heightens these equipments' speed and precision,especially enhances its performance under the condition of high-speed moving is the hotspot of the domestic and international research development.The research is from techonological project of Guangzhou city (2004Z3-D9021): Research of Basing on IC encapsulation with parallel mechanism.This text designs and develops the Bonding Head for the IC chip die-bonder with parallel mechanism.sets up the optimized-model, and sets up the optimized-model for running distance of right slider crank and the whole length of slider track.Basing on the optimized result,the model of Bonding Head for the IC chip die-bonder with parallel mechanism will be made out. Setting up the equation of kinematics,by analyzing and solving kinematics equation with positive solution and negative solution,motion rules of the bonding head and drive point are obtained,and by using example to verify these rules.In control part,the motion control system for parallel mechanism is designed, and those questions that the principle and use of motion control card and servo motor are discussed.To use C language to programme of control , and to control the motion system under the circumstance of DOS.And how to use the control interface,are also discussed.By designing and developing Parallel Plane Mechanism, and researching its work principle,the structure,parameters of IC encapsulation key machine,relative data,curves,graphs can be obtained,which forms some rules and theories.Guiding the structure design and application of IC encapsulation machine.The mechanism has applied for patent(The bonding head for the double degree of freedom die bonder with plane double slider crank ZL 2004 20093649.4).