The Study Of Surface Roughness Of Ag Thin Films

Ag thin film has attracted researchers because of its excellent photoelectric properties and application prospect of extensive attention. In recent years, nano metal Ag material surface plasmon polaritons(SPP) due to their unique optical properties, it is becoming an important research topic at present. The traditional optical imaging because there is limited by the diffraction limit, resulting inoptical imaging resolution can only achieve the maximum wavelength of the incident light1/2. In order to break the diffraction limit in order to achieve super diffraction optical imaging, domestic and foreign researchers put forward super lens device to achieve this goal. As an important part of the Ag film super lens device has become the object of many scholars study. To achieve super lens device, need to solve several key technologies, the Ag film surface is an important part of the lens device roughness is one of them. In this paper, taking it as the research object, study on preparation process on the surface roughness of Ag film and the influence of the theoretical simulation of Ag membrane effect of surface roughness on the imaging lens device. The main research contents and conclusions are as follows: 1. using the theory of simulation software, research on the Ag film surface roughness effect and influence degree in the super lens in the device. Found along with the silver layer roughness increases, the quality of imaging contrast decreased gradually; when RMS is equal to zero(ideally), the quality of the image contrast is 0.93, when RMS increased to 2.6 nm, the quality of imaging contrast is reduced to 0.6. 2. using two kinds of method for evaporation and magnetron sputtering Ag thin film was prepared, the surface morphology of system properties of Ag films was investigated, in order to improve the Ag film surface roughness of super lens device provides the basis. 3. studies in the Ag film prepared by magnetron sputtering, sputtering power and sputtering pressure on the effect of Ag film deposition rate and surface roughness. Found that changing the process parameters by using magnetron sputtering method, RMS can be reduced from 5.0 nm to 1.1 nm. Under the same sputtering power, sputtering pressure rose from 1.0 Pa to 3.0 Pa, deposition rate and surface roughness of Ag film with the sputtering pressure decreases. 4. studies in the condition of evaporation resistance, joined the Cu seed layer on the surface roughness of Ag film, the particle size and Sk The influence and the parameters of Ku.