I Wafer Pretreatment Process Optimization

Business process reengineering is an important solution to improve core competitiveness of enterprises. The concept of BPR (Business Process Reengineering) was announced by the American academic in earlier 1990s. To optimize business process, both the company abroad and local put huge resource into the business process reengineering, but the result was not satisfying as expected. Facing 80% failure rate, Entrepreneurs begging to research the business process reengineering, they will not do it without thinking and make a big change in the reengineering method, and they put more attention to the relationship between the strategy and the goal of the company.There are so many factors which induced business process reengineering fail. Although the company efficiency can be improved, but there is no pure gain from whole picture. Base on the result, the object of business process reengineering must be the bottleneck of the company, or the reengineering will not improve the performance.To optimize business process reengineering, we introduce the concept of TOC (Theory of Constraints) into BPR, and use the BPI model in the die preparation process of I company.The main content of this article are:1. Introduced current status and issue of BPR research in the local and abroad.2. Analyzed the character and the type of BPR, summarized the strategy and principles of BPR and concluded the condition and content of BPR.3. Introduced the TOC into BPR, discussed the huge advantages of the combination of TOC and BPR, and put the theory into practice.4. Depending on the advantages of information technology, we do the BPI for the die preparation process of I company, improved the performance of the process and establish the significant meaning of combination of TOC and BPR.