Research On Characteristics Of Reed And Manufacturing Of Reed Panel

Developing the straw-based panel industry in China would be benefit to solve the shortage of wood supply and protect the forest resources and environment. In this paper, the characters of reed and the manufacturing technology of reed panel were researched, and the results of this research have certain guiding sense for the production and application of reed panel.To provide a theoretical basis for the preparation of the reed panels, the features of reed were investigated, including pH value, buffering capacity, wettability and surface functional groups. Based on the measure of reed characters, the optimal technology parameters for producing reed flakeboard and reed/wood composite board were confirmed through the orthogonal test, and the reed panel with excellent properties and moderate cost was eventually manufactured. The main results are as follows:(1)The pH values of reed, reed leaf and reed stem are5.19,4.58,5.00respectively, and the buffering capacities are24ml,37ml,32ml. The FTIR shows that the characteristic peaks of-O-Si-O-groups and fatty acid materials on the surface of reed are significant. Moreover, there are fewer-OH groups and more silicon materials on the outer surface of reed leaf, and the reactivity of reed stem inner surface is higher than the outer surface. Reed stem has better wettability than reed leaf, while MDI has better wettability on reed than UF.(2)There is gluing reaction between reed and MDI at80℃,with the phenomena of endothemic reaction. Only curing reaction of UF occurs in the mixture of reed and UF, and the gluing reation between reed and UF is not evident.(3)The optimal technology parameters for reed flakeboard are as follows:temperature of hot-pressing170℃, time of hot-pressing30s/mm, amount of glue6%, ratio of coarse particles20%, density of board0.85g/cm3. According to above parameters, the MOR, MOE, IB TS of the reed flakeboard is20.9MPa,3.43×103MPa,0.36MPa and2.13%, all of which are up to the requirements of standard GB/T4897.3-2003.(4)With MDI for reed particle and UF for wood fiber, it is feasible to manufacture the composite board by mixing reed particle and wood fiber. The results show that for composite board, the optimal technology parameters are as follows:ratio of wood fiber30%, amount of UF glue for wood fiber12%, amount of MDI glue for reed particle4%, time of hot-pressing30s/mm, temperature of hot-pressing 170℃. According to above parameters, the properties of the composite board can fulfill quality requirements of standard GB/T4897.3-2003.