Study On The Grinding Temperature Field Of SiCp/Al Composites

Outstanding mechanical and physical properties of SiC particle reinforcedaluminum matrix (SiCp/Al) composites such as high specific strength, stiffness, wearresistance, fatigue tolerance, good dimensional stability and thermal conductivityindicate that this material has more significance in the areas of aerospace, military,automotive engineering, electronic packaging and other diverse industries. But theproblems exist that the composites is difficult to be processed and the good surfacequality is hard to get. For these reasons, industrial application of the composites hasbeen limited. Grinding machining is one of the most important manufacturingprocessing methods, especially in the field of precision processing. However, theextremely high energy during grinding transforms into heat concentrated in the grindingzone, which can lead to the generation of high temperature. Various type of thermaldamage to the workpiece will happen if the temperature is more than the critical value.And this will affect the service life of the parts and performance. So it is especiallyimportant theoretical significance and practical value to realize high surface integrity. Inthis paper, the theoretical calculation, experimental measure and finite elementsimulation have been used to study on the grinding temperature field of SiCp/Alcomposites. The main content is summarized as follows:The heat transfer mechanism, the models of heat source and the distributionproportion have been discussed. A right triangular heat source and the distributionproportion of W. B. Rowe were used in the calculating of heat flux under differentgrinding parameters.The micro-finite element model of SiCp/Al composites was built, and the internalstress and residual stress in the freezing process using liquid nitrogen were calculated.The results show that tensile stress was generated within Al matrix and the compressivestress was generated within SiC particles. However, the results of the residual stresswere exactly the opposite.Thermocouple thermometry was used to measure the grinding temperature underdifferent parameters. The results indicate that the tangential grinding force and surface temperature of the workpiece increased with the grinding depth and speed of workpieceincreasing. Temperature distribution in the depth direction of the workpiece andaccumulation grinding temperature throughout the grinding process were measured bythermocouple distributed in different locations.The software ANSYS was used to simulate the temperature field correspondingwith the experimental parameters. And the simulation results were verified by theexperimental results. The results show that the simulation and the experimental valueare matched preferably.