Research On The Friction Temperature Field Of Copper-Based Bearing Materials Based On Backstepping Heat Flow Method

In this paper，a test device for placed infrared probe is specially designed toenable the temperature on the frictional interface to be measured，which is basedon the improvement of the clamping structure， an important part of themulti-functional environment-controllable tribometer (MECT). The interfacetemperature of the friction pair is measured by the infrared temperature probewith high sensitivity. The method which combines the non-contact infraredmeasuring temperature，the finite element simulation and the thermocoupleverification is used to simulate the heat flux distribution coefficient of frictionpair. In that case，we can not only overcome the larger problem because of thefriction pair heat flux distribution coefficient theoretic calculation error toprovide the foundation for temperature field of the exact solution，but alsoestablish the three dimensional temperature field model based on the test offriction and wear.On the basis of the above，the temperature fields of the copper base bearingmaterial will be simulated on the conditions of the friction wear and thedifferences between the temperature fields of the different materials will beinvestigated in fiction，This paper analyze the temperature fields of frictionpairs for different contact area and study the influence of the different thermalconditions to the temperature field under the condition of interfacial friction，also investigate the feature of temperature fields of Copper-Base BearingMaterials under the different conditions; research the temperature fields of threetypical Copper-Base Bearing Materials，to analysis the differences between thetemperature fields of the materials under the condition of the friction and therelations between the feature of material and the temperature field. Simulationshowed that the characteristics of the Cu-1.5Bi Copper-Base Bearing Materialwas unstable and the temperature rose larger because of the fewerLow-Melting-Point; the characteristics of the Cu-3.0Bi Copper-Base BearingMaterial between the two， and nearly the Cu-10Pb Copper-Base Bearing Material. The analysis of the temperature field for contact surfaces of frictionpairs showed that the temperature was different between the different locationson the contact surface of friction pair， the temperature was highest on one thirdposition and the corresponding wear was largest. Furthermore the influence oftemperature to wear is significant. The research of this paper provide sometheoretical basis for the design of thermal conditions to friction pairs and theresearch of wear characteristics to Composite Material.