The Study Of The Inventory Control In IC Module Encapsulation&Test Factory

Semiconductor manufacturing is a highly capital-intensive, highlycomplex flow process. With the rapid development of the market, ICpackaging technologies and processes are constantly upgrading. Theintegrated circuit manufacturing systems is widely recognized as the mostcomplex manufacturing systems, and IC packaging production system isrelatively complex, as compared to the wafer manufacturing process, theexistence of the decomposition of the production batch, merge.Intelligent microchip encapsulation technology development toward lowpower consumption, small size, high-speed, high-integration direction, a newpackage design, packaging technology, packaging equipment continue toemerge, smart micro-chip packaging and testing companies face in the nextfew years,competition in the external environment will also be intensified. This balance and production planning and control, such as the capacity of theproduction line can put forward higher requirements and the manufacturingof integrated circuits requires a huge capital investment, including equipmentand raw materials, coupled with the production capacity of the equipment forthe production of hybrid products more sensitive.Therefore, the in IC manufacturing enterprise, how to arrange theproduction plan optimization in order to improve equipment utilization,reduce inventory and manufacturing cycle, has become a very difficultprocess, but also become the great enterprise to ensure its competitiveadvantage challenging tasks.This paper attempts to by IC manufacturing advanced direction,combined with the theories and methods of lean production the intelligentmicrochip encapsulation enterprise production planning and lean productionand put forward practical improved methods. Use pulling plan method, noticesystem and team work model to module factory. Analyze the KPI trend formanufactory company and get the control tools is effective.