Numerical Simulation And Optimization Of Double Micro-gear Die Cavity Embedded Lump Electroforming Layer Uniformity Based On ANSYS

Micro-fabrication technology was the core and basis of MEMS technology. UV-LIGA technology was more commonly used in micro-fabrication technology and directly determined the quality of the final product.Therefore,it is meaningful to study the theory of micro-electroforming technology and process for the development of UV-LIGA technology and the improvement of product quality.This thesis selects the Micro-gear Die Cavity embedded lump as the research object,mainly studied finite element simulation and optimization which was used in the application of multiple quality objectives and process parameters, and put forward a set of integrated optimization scheme.(1)According to the field theory model of double micro-gear die cavity embedded lump electroforming, defined Error(a) and Error(b) to judge layer quality uniformity,,and simulated by ANSYS. The insulating baffle applied to the casting quality has been improved obviously.(2)Then the orthogonal test was designed, and the insulation baffle parameters distanceH, inside diameter d, outside diameter D, thickness t was selected as experimental factors; Error(a) and Error(b) was selected as the evaluating product quality experimental target;the simulation software ANSYS was applied to simulate orthogonal test scheme, the best corresponding optimum process parameters were obtained(3) By grey relational gradeas calculating,the comprehensive quality of casting layer optimal parameters were obtained.The results show that:through applying the method of insulating baffle, the uniformity of casting double-layer micro-gear die cavity embedded lump electroforming process was effectively improved.