| Cement concrete pavement is widely used in all levels of road, how to extend the cementpavement life and improve driving comfort, which has become the road workers concernedproblems. However, the state of interlayer adhesion has a certain impact to load stress andtemperature stress between the concrete slab and the semi-rigid base. The current designapproach suppose that interlayer contact state between concrete slab and sub-base is smoothand free of friction, which have great differences with the actual situation. The temperaturestress and load stress need depth analysis when the interlayer fully adhesion.In this paper, determine the comprehensive interlayer adhesion coefficient throughcomparative analysis ANSYS finite element and field measured values of the load stress, thetemperature stress, and the temperature-load coupled stress in different contact state betweenlayers of semi-rigid base cement concrete pavement. Proposed the cement paste interlayeradhesion technology based on low temperature, which can bond concrete slab and cementstabilized macadam. Calculated the concrete pavement temperature stress and temperature-load coupled stress of linear temperature field and nonlinear temperature field of differentinterlayer adhesion condition. The calculated results and field data show: from use the cementpaste interlayer adhesion technology, the produced pre-stress in the concrete slab can offsetpart of the temperature-load coupled stress, and improve the stress state of the concrete slab,and can extend the service life of the cement concrete pavement. From study the interlayeradhesion, the author got the maximum plate length, the best construction temperature and thepre-stress effective period of concrete slab under the action of creep. Under interlayeradhesion state, got the best thicknesses and the best plane sizes of slab, got the best elasticmodulus of sub-base. The results of this study can provide theoretical guidance for thestructural design and construction of the interlayer adhesion concrete pavement. |