Project Risk Analysis Of Semiconductor Equipment New Product Introduction

With the development of information technology, Internet+ and industry 4.0, and the release of "China manufacturing 2025" planning, the semiconductor industry has ushered in an unprecedented development opportunity. The New Product Introduction stage is a key link between the development stage and volume production stage of semiconductor equipment. Effectively identify and analyze the project risk in this stage, will improve the success rate of the semiconductor equipment project, and promote the technology progress of the semiconductor industry.This paper takes the New Product Introduction process of BGT project in U company as an example, studied the risk factors that may be encountered in the process of new product introduction of semiconductor equipment, use multiple methods to identify and list the project risks, through FMEA tool to assess the Severity Rank, Occurrence Rank, Detection Rank of each risk, sort the order according to the RPN, get the key risk factors of BGT project. Human Error was detected as major risk factors because of the characteristic of this project.For better understanding the project risk of BGT project, the paper based on Human Reliability Analysis (HRA) technology, using CREAM method to analysis the root cause of human errors. According to the questionnaire result and PCA method to obtain the influence factors which would affect the human error root causes. With the result of analysis, appropriate corrective and preventive actions are taken to manage the risk of BGT project and lead the project to success.The results of the research indicate that the risk of new product introduction process in semiconductor equipment manufacturing industry can be effectively identified and analyzed by using FEMA technology and human reliability analysis technology.