Research On Secondary Growth Of Silver Nanowires And Eletroplating-improved Silver Nanowire-based Transparent Conductive Films

Silver nanowires is a kind of new 1D nanomaterial which have high aspect ratio,surface activity and excellent conductivity.It is widely used in transparent conductive films(TCFs),catalytic material,bio-sensors and electronic paste etc.The property and application of nanodevices are dependent on the size,morphology and growth direction of silver nanowires.Therefore,it is important to further explore the controllable growth research.Nowadays,silver nanowire-based transparent conductive films have caused widely attention,however,due to its high contact resistance,low substrate adhesion,bad thermal resistance greatly restrict its property as well as application.Based on such drawbacks,this research mainly focused on:Polyol method was adopted to do the second growth research,while 0.1 mM FeCl3 was added as seed loading reagent to load seeds on the silver nanowires.Meanwhile,the quantity of AgNO3,ratio of AgNO3 and PVP,time and temperature were all investigated for the impact of second growth.The result showed that when the quantity of AgNO3 and ratio of AgNO3 and PVP were fixed,higher temperature and longer reaction time would promote the growth of seeds,making PVP absorbed on the surface of silver nanowires fully and then get higher aspect ratio second growth silver nanowires.Finally,it is assured that the reaction condition is 200 ? react 9 hours,which 0.1 mM AgNO3 with a ratio of 1:8 with PVP in glycerol solution.Using dip coating method to fabricate the silver nanowire-based transparent conductive films and research the impact of electroplating metals(Ag,Cu,Ni)to improve the TCFs property.It is discovered that electroplating can eliminate the contact resistance effectively and improve the TCFs' property.After Ag electroplating and Ni electroplating,the transmittance of TCFs reduced less than 3% while the sheet resistance reduced 200 times(The Ni electroplating TCFs has the transmittance of 96.3% with a sheet resistance of 4.8 ?/sq and Ag electroplating TCFs with a transmittance of 96.2% and sheet resistance of 3.6 ?/sq).Cu electroplating leaded to the TCFs transmittance transfer from 99% to 94.5% and sheet resistance reduced 30 times,from 1000 ?/sq to 26.7 ?/sq.According to the experiment data,the best condition for electroplating is differed by eletrodeposited metal,which Ni is 5 V 1 min,Ag is 3 V 10 s and Cu is 3 V 15 s.For further exploring the property and application potential of electroplating TCFs,the substrate adhesion and thermal resistance were investigated.After tape peeling circle test of electroplating TCFs(Ag,Cu,Ni)and AgNWs-based TCFs,result showed that Ni electroplating TCFs possess the best substrate adhesion which it can maintain its conductivity unchanged after 200 times peeling,however,others were all failed in 20 times.Thermal resistance was also explored systematacially.After a series experiment,Ni electroplating TCFs show best thermal resistance for it can maintain its conductivity after heated at 500 ? for 30 min.In comparison,the resistance increase of Ag electroplating,Cu electroplating and AgNWs TCFs were all reached to 3000%.In conclusion,electroplating can improve AgNWs-based transparent conductive films while Ni electroplating shows the best result among all three electroplating metals(Ag,Ni,Cu).