Study On Cutting Edge Rate And Sawing Performance Of Electroplated Diamond Wire Saw

About 80%of photovoltaic cells in the world are made of silicon crystal,but the high cost of silicon wafer restricts the wide application of photovoltaic cells.The photovoltaic industry will speed up the promotion and application of photovoltaic clean energy by reducing the non-silicon cost of silicon wafers,pursuing the affordable access to the sawing web.Photovoltaic silicon chip processing is an important machining process.The quality and efficiency of chip processing have an important impact on the manufacturing cost of solar photovoltaic cells.Electroplated diamond wire saw has been widely used in photovoltaic silicon chip.In order to reduce the non-silicon cost of photovoltaic silicon chip,high-performance electroplated diamond wire saw and corresponding high-efficiency and high-quality chip processing technology are urgently needed.In this paper,the morphology and slicing performance of electroplated diamond wire saw are studied.The main analysis object is the cutting edge rate of abrasive particles and nickel coating on the surface of electroplated diamond wire saw.By studying the cutting edge rate of abrasive particles on the surface of electroplated diamond wire saw,the influence of nickel coating on the chip processing performance,and the removal rate of slicing materials,the requirements to meet the slicing performance are proposed.The method to determine the cutting edge rate of the electroplated diamond wire saw that fulfill the demand of machining is given.The research work is of great significance to improve the manufacturing quality of electroplated diamond wire saw.The main work of this paper is as follows:(1)According to the actual morphology of electroplated diamond wire saw,considering the real shape of abrasive particles and their distribution on the surface of diamond wire saw,a three-dimensional model of electroplated diamond wire saw is established.Based on the three-dimensional model of electroplated diamond wire saw,the standard parameters and the calculation method of the cutting edge rate are established,and the testing method of the cutting edge rate is verified by the three-dimensional model of electroplated diamond wire saw.(2)Considering the influence of nickel coating on the surface of electroplated diamond wire saw and the cutting demand of abrasive cutting edge on the surface of electroplated diamond wire saw.This paper studies the minimum cutting force of electroplated diamond wire saw,and simulates the effects of the cutting edge rate,the wire speed and the feed speed on the minimum cutting force of electroplated diamond wire saw.It is found that the minimum cutting force increases with the increase of cutting edge rate,decreases with the increase of wire speed and increases with the increase of feed speed.(3)Considering the nickel layer on the surface of electroplated diamond wire saw,the material removal rate of electroplated diamond wire saw cutting photovoltaic silicon was established.The effects of cutting edge rate,wire bow and wire speed on material removal rate were simulated and analyzed.Under the condition of this paper,the material removal rate of the electroplated diamond wire saw is higher when the cutting edge rate of the electroplated diamond wire saw is from 100 to 200 pieces/mm.Within the allowable range of the maximum deflection of wire bow,the material removal rate is positively related to the maximum deflection of wire bow and wire speed.(4)Based on the study of material removal rate of electroplated diamond wire saw,the calculation model of wire bow in the process of cutting electroplated diamond wire saw was established.The influence of the cutting edge rate and process parameters of electroplated diamond wire saw on the wire bow was studied-The process parameters matching with electroplated diamond wire saw with different cutting edge rate were simulated.In the cutting process of electroplated diamond wire saw,the wire bow is inversely proportional to the wire speed and directly proportional to the feed speed.Under the condition of this paper,when the cutting edge rate of electroplated diamond wire saw is from 100 to 150 pieces/mm,the maximum deflection of wire bow processed by slicing is smaller.When the ratio of wire speed to feed speed is 2.25?3,the cutting edge rate of abrasive is from 100 to 200 pieces/mm,and the tension force FS=15N,the maximum deflection of wire bow processed by slicing is 3mm.