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Research On Theoretical Analysis, Simulation And Design Of Millimeter Integrated Circuit Based On LTCC Technology

Posted on:2009-01-16Degree:DoctorType:Dissertation
Country:ChinaCandidate:C G LiFull Text:PDF
GTID:1118360245479139Subject:Communication and Information System
Abstract/Summary:PDF Full Text Request
The low temperature co-fired ceramic(LTCC) technology and three dimensional(3D) integration technology of millimeter wave circuits are excellent methods for realizing miniature volume, light weight, high performance and reliability of air-borne, ship-borne, and satellite-borne electronic equipments. The 3D integration technology based on LTCC has become one of the hotspots in the millimeter wave circuit and system research field. The integration of the miniaturized T/R module and antenna is analyzed and studied based on LTCC and 3D integration technology with the National defense fund.The dissertation is focused on theory analysis, circuit and system simulation, partial sample manufacturing for the key technologies to develop 3D millimeter wave circuit. The one minension scanning phased array antenna is designed to resole grid restrict of phased array antennas. The main research can be summarized as follow:(1) The model and improved structure of the bonding wire and vertical via interconnects is founded. The tuning stub of transmission line increases cut off frequency of transmission character. The loss of transmission line is decreased by optimization. Design time is decreased by optimum arithmetic.(2) The folded edged coupled filter is designed by analysis and simulation. The complex analysis of corner of filter is analyzed by neural network and genetic algorithm. This method decrease difficulty of the design.(3) The equivalent transmission line model of electromagnetic coupled antennas based on cavity is put forwards. The surface wave and parallel mode of patch based on LTCC is compressed by cavity. Meanwhile efficiency of antenna is improved. The equivalent cavity is optimized by neural network and genetic algorithm. The bandwidth of antenna is improved by tuning stub and wide band matching.(4) The resonance character of cavity is analyzed by the cavity model. The parameter of equivalent cavity is optimized and designed by neural network and genetic algorithm.(5) The series micro-strip array antenna and the T/R module are designed and engineered. The series micro-strip array antenna based on LTCC is simuated and designed by means of backed antenna and series micro-strip array antenna.(6) Finally the element of the T/R and series array antenna is designed for trapezoid structure. One dimension phased array antenna is designed by displacement stagger. The conflict between bigger volume T/R module and smaller space of element is settled. The port space of multi-beam Parabolic reflector is settled. The integration and miniaturization of millimeter wave phased array antenna and T/R module are realized.
Keywords/Search Tags:LTCC, bonding wire interconnect, via vertical interconnect, folded filter, backed antenna, T/R module, neural network, genetic algorithm, tuning stub, miniaturization
PDF Full Text Request
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