The Modeling Design And Thermal Analysis Of Solid State Relay

In this paper, a secondary development system of AutoCAD is discussed. It is a project instructed to us by Beijing Keytone Electronic Relay Corp. The system is made up of two parts: First, the modeling design system. Second, the thermal analysis system of the model of solid state relay (SSR).The modeling design system is a secondary development system of AutoCAD 2000. In this part, the idea of three-dimensional modeling design is realized. The field of engineer design is changing from two-dimensional design to three-dimension design at an unprecedented speed. In a environment of three-dimensional design, the designer can exert their ingenuity freely. So new and novelty product is more likely to work out. The modeling design system is also made up of tow complementary parts: first, the data bank system of ODBC-Access, it stored the measurement parameters and the specialized knowledge of the design of SSR. We can also say this part is a combined system of data bank and expert system of SSR. Second, the modeling design system of AutoCAD 2000. The system read the bank, use data to draw or insert AutoCAD blocks to design.The thermal analysis system is a secondary development system of ANSYS. This part is design to examine the design of SSR, and can provide something to designer to improve the modeling design. The system will build up mathematic model according to the operating characteristic of electrical apparatus of SSR. And then analyze it and work out the nephogram. And so the designer can see where is designed irrational and improve the modeling design.