Font Size: a A A

Project Management Theory In The Development Of Chip Packaging And Testing Equipment

Posted on:2009-12-15Degree:MasterType:Thesis
Country:ChinaCandidate:T MuFull Text:PDF
GTID:2199360272459491Subject:Project management
Abstract/Summary:PDF Full Text Request
Along with economic globalization, regional integration development, as well as China's accession to the WTO and gradually perfect the market economic system, project management is drawing more and more of our attention. When we are committed to the establishment of a modern enterprise system, the western developed countries are energy into project management. Project acts as an important component of economic development factor, it became the key of the state, enterprises, and social issues. Project management play a vital role in successful project development. It's flexibility also adapted to the changing requirements of enterprise products. Therefore, in-depth and extensive project management practice, improve project management level is the objective requirements of economic development. As China's market competition intensified into a raise, enterprise project management capabilities and enhance the competitiveness of their products against business risks has become an increasingly important issue of the modern enterprise.This article analyzed the basic theory of Project Management, express the structure and implement steps of Porject Management and how to combine it with actual implement. Then introduce chip packaging and testing equipment and the basic technical details of the domestic and international market, analyze the feasibility of apply project management in this area, highlight the important role of project management.Finally, through a combination of the theory of project management and bring out that equipment enterprises must strengthen the development of chip packaging and testing equipment development project management and process management and the establishment of perfect rules and regulations, promote standardized management to achieve the leadership in technological innovation.Hope that this research and analysis can achieve the purpose of theory to guide practice, thus enhancing our chip packaging and testing equipment enterprise project management capabilities, and to make them invincible in the highly competitive international market.
Keywords/Search Tags:chip package and test equipment, bonding, Project, Project management
PDF Full Text Request
Related items