| Due to the rapid development of artificial intelligence,automotive electronics and consumer electronics in recent years,the annual growth rate of semiconductor industry is over 20%.Therefore,aiming at the problem of low efficiency of using single workpiece and single blade,and design a high efficiency Inside diameter slicer with four-columns and eight-station.And multi-objective optimization of the machine bed was carried out by RSM and NSGA-?.The theory and simulation analysis of mechanical tensioning inner circular blade are carried out,and design a device for measuring the tension of inner circular blade.The main contents of this thesis include:1.Propose a new technology solution for Inside diameter slicer,and design a high efficiency Inside diameter slicer with four-columns and eight-position.Researching and designing the slicing scheme,tensioning method,general structure layout,cutting spindle system and feeding system.2.Through modal analysis of machine bed,combined with RSM and NSGA-?,multi-objective optimization of machine bed with natural frequency and weight as objective function was carried out.3.The mechanical model of mechanical tensioning inner circular blade is established,and research the stress and strain of inner circular blade by theoretical calculation and finite element simulation.The deformation of inner circular blade under vertical load and non-uniform bolt pretension is simulated and analyzed.4.According to the principle of different tension degree with different vertical load deformation on the blade face of inner circular blade,design a device for measuring tensioning degree.The displacement sensor,data acquisition card and the upper computer program of LAB VIEW are used to measure the vertical deformations,and judge the tension degree of the inner circular blade. |
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