Study On The Enhanced Modification Of Epoxy Infrared Spectrum By Used

Epoxy is one of thermosetting resin,it is used on casting and encapsulation of power electronics becase of it have excellent gleyness mechanical strength electric -insulation and so on…At present common silicon powder modifiation epoxy applied most widely Common silicon powder modify epoxy have great price advantage.The epoxy modified by commom silicon powder of mechanical properties,electrical properties,material viscosity have certain limitation.Silicon powder dispersion and composite interfacial bonding have close relationship.We use coupling agent KH-550 activated silicon powder .for solve the problem of composite .The dispersion improve and coupling agent improve composite interface connection. The study is do from three aspect: frist the performance of epoxy composite material is modified by commom silicon powder;second the performance of epoxy composite matrial is modified by silicon powder modified by coupling agent KH-550;Last part the modify principle is discussed by infrared spectrum..The addition way of coupling agent KH-550 ,we use alcohol to dilute coupling agent and the proportion is one coupling agent and nine alcohol.Dry method is used for coupling agent KH-550 and alcohol complete contace.Frist the silicon powder is let in modify equipment with 100℃to 120℃for preheating dry.The aim is dehydration and improve surface activity. Alcohol and coupling solution is addition by forms of spray.The modify is on a certain temperature time and stirring speed.The activity silicon powder is obtained from selection.In the study we find that silicon can effect epoxy performance great.Epoxy's toughness improve great.A t the first,epoxy toughess increased wih the addition of silicon powder.But the epoxy mechanical properties decreased wih the addition of silicon more and more.The activity silicon powder modify epoxy is good than commom silicon on mechanical properties,electricity and thermal properties.the reason is that coupling agent with active group can be used as bridge for connection silicon powder and epoxy.The interface of epoxy is improve,Reuniting effect is decreased and the dispersion is improved.The dispersion is more good the modify effect is more significantly. The modify core is that activity film from with coupling KH-550 can improve silicon powder dispersion in epoxy wih the infrared spectrum analysis and SEM picture.The crosslinking degree is changed.The crosslinking degree effect epoxy composite material performance.The crosslinking degree is good the mechanical improve.The inorganic fillers will make epoxy'crossling largen but if the content is too much the epoxy'crossling degree will decrease.The reason is when inorgannic fillers seldom it occupy epoxy interspace ony.It can homogeneous disperse don't influence epoxy curing reaction.If the inorganic is too more ,it will aggregate hinder epoxy with solidifying agent contact and decrease epoxy flexible.Copling agent film encapsulated silicon powder surface.It can play buffer action and connection between silicon with epoxy.Copling agent will participation in epoxy's curing reaction.The crossliking degree will improve.In the study,the epoxy composite material enhancement modification'microcosmic will be explanation wih infrared spectral analysis test technology.The modify effect is quantitative analysised.Silicon and activity silicon modify epoxy'all kinds of mechanmical property,thermology performance,electricity performance effect resuluts graphs is made.It is useful for production.if the best formulation choosed,the best economic benefit and product quality all will be obtained.