Several Applications Of Electromagnetic Components Integration Based On Flexible Multi-layer Foil Technique

With the emergence of new energy technology and the rapid development of information industry,power and electronic equipment applied in communication system,industrial automation,aerospace and other fields are gradually developing towards miniaturization,lightweight and high-frequency.Switch power supply with high power density is favored by more and more people.Firstly,this paper introduces the development of switching power supply,and analyzes the development trend of high frequency,green,digital and integration of modern switching power supply technology.Then,the development of magnetic integration technology is summarized,PCB(Printed Circuit Board)integration technology and FMLF(Flexible Multi-Layer Foil)integration technology are introduced,and the structure and advantages and disadvantages of the two integration technologies are compared.The integrated technology of electromagnetic components is an effective technology to improve the power density of switching power supply.Secondly,aiming at the new integrated Boost resonant converter,the integrated structure I of two boost inductors,two resonant capacitors and one transformer made by FMLF integrated technology is proposed.The integrated structure design and electromagnetic analysis are given.The distributed parasitic capacitance DEMC(Distribute Electro-Magnetic Component)model of integrated windings is established,and the loss analysis of the integrated structure I is illustrated,the electromagnetic simulation model is established to extract the coupling coefficient of the integrated winding.Finally,the correctness of integrated structure design is verified by a 350 W experimental prototype.Then,this paper briefly analyzes the design of series resonant power parameters for multi-output LED driver circuits with hybrid passive current sharing.A large number of passive components exist for the four-channel series resonant LED driver.An integrated structure II with two common-mode inductors,two resonant capacitors,one resonant inductor and a transformer is proposed,and the electromagnetic analysis of the integrated structure II is given.The correctness of the main power parameter design and the current sharing effect of the circuit were verified by open-loop simulation.A 20*4W integrated structure II prototype was fabricated and the effectiveness of the integrated structure II design was verified by electromagnetic simulation software.Finally,this paper proposes a new type of interleaved Sepic converter,briefly analyzes the main power parameter design in the new interleaved Sepic converter;illustrates the design of integrated structure III and flux analysis and parameter design,and finally builds a 600 W experimental prototype and simulation model,the feasibility of the integration scheme is verified by electromagnetic simulation.